Degradation in FPGAs: Measurement and Modelling

Edward Stott1,  Justin Wong1,  Pete Sedcole2,  Peter Cheung1
1Imperial College London, 2


Abstract

Progress in VLSI technology is driven by increasing circuit density through process scaling, but with shrinking geometry comes an increasing threat to reliability. FPGAs are uniquely placed to tackle degradation and faults due to their regular structure and ability to reconfigure, giving them the potential to implement system-level reliability enhancements. To assess the scale of the challenge, a method for measuring and monitoring degradation in an FPGA was developed and used to conduct an accelerated life test on a modern device. This revealed a clear, gradual degradation in timing performance that matches the expected effects of Negative-Bias Temperature Instability and Hot Carrier Injection, two of the most important VLSI degradation mechanisms. Further insight into ageing phenomena was gained using modelling --- showing how degradation in a typical LUT would be affected by different usage conditions, and predicting in detail the effects on circuit behaviour.